Biannual Thermal Analysis Application Magazine, Volume 54
UserCom

Thermal Analysis UserCom 54

UserCom

UserCom Is a Biannual Application Journal Intended for All Users of Thermal Analysis Instrumentation

Thermal Analysis UserCom 54
Thermal Analysis UserCom 54

Table of Contents:

TA Tip

  • Isothermal calibration and adjustment, Part 2: Heating rate dependence of temperature measurement

News

  • New reference library versions
  • The new Validation in Thermal Analysis handbook
  • User manuals and other useful aids

Applications

  • Characterization of gelatin and gelatin gels by TGA/DSC-MS, DSC and TMA
  • Moisture curing of an adhesive using the TMA/SDTA 2+
  • Reverse engineering of an unknown elastomer
  • Influence of sample volume in the high-pressure crucible on the DSC signal

Dates

  • Exhibitions, Conferences and Seminars