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Wafer Cleaning and Rinsing

UPW removes particles and chemical residues from wafers. Elevated microbial counts can promote biofilm buildup on equipment, releasing particles and metabolites that cause surface defects and corrosion.

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Chemical Mechanical Planarization (CMP)

Slurries and water used in CMP can support microbial growth. Contamination here results in particle generation and biofilm deposits on polishing pads and wafers, affecting surface uniformity and causing defects.

No single measurement captures the full picture of ultrapure water quality. Resistivity works alongside several other on-line parameters to ensure process integrity.

Select a parameter to explore:

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