To show how DSC can be used to study the effect of molding time on the curing of Sheet Molding Compounds.
In the development of a resin system for SMC prepregs based on UP resins, the following points have to be investigated:
Handbook | | Page | | Keywords |
Thermosets 2 | 123 | thermoset, curing, DSC, molding resin, molding time, prepreg, SMC, postcuring, |
Molding Times for Processing SMC | Thermal Analysis Application No. HB 76 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2