This application investigates the curing process of an uncured epoxy system by monitoring its mechanical behavior.
Handbook | | Page | | Keywords |
Thermosets 1 | 125 | thermoset, curing, DMA, shear mode, curing measured by DMA, gel point, KU600 epoxy resin, |
Curing measured by DMA | Thermal Analysis Application No. HB 29 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 1