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Case Study: Precision Weighing in CMP Slurry Production

Achieve precise, repeatable results in slurry formulation and mixing processes

Chemical Mechanical Planarization (CMP) is a critical step in semiconductor manufacturing. Precise weighing results in the slurry process impact wafer quality and help to make transistors smaller to develop the next generation of chips.

In this case, a leading producer of semiconductor chips in Asia sought higher precision in its CMP formulation process with a fully integrated, high-precision solution.

Download the case study to discover how they benefit from improved accuracy and automation.

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