Chemical Mechanical Planarization (CMP) is a critical step in semiconductor manufacturing. Precise weighing results in the slurry process impact wafer quality and help to make transistors smaller to develop the next generation of chips.
In this on-demand webinar, we describe the importance of high-precision weighing in wafer production and highlight how manufacturers can benefit from a risk-based approach to select a weighing solution that best suits their specifications.
The global demand for semiconductors is rising as more and more microchips are used in electronic equipment, and they need to be produced to very specific requirements to deliver the expected performance.
Download the case study to discover how a leading producer of semiconductor chips benefited from improved accuracy and automation in the slurry production process.
