Light Curing of Adhesives

This application describes how the curing behavior of a technical adhesive used in the manufacture of access arms for the read/write heads of hard disk storage devices was investigated (see Figure). The approach chosen was to simulate the production methods in a DSC-photocalorimeter system, and to analyze the samples cured in this way with respect to their postcuring behavior.
The results were then compared with measurements of real samples taken from different access arms.

_{Light curing of adhesives | Thermal Analysis Application No. HB93 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2}