UF: Curing Kinetics of Molding Compounds - METTLER TOLEDO

UF: Curing Kinetics of Molding Compounds

To show how kinetic analyses based on just a few DSC measurements can give a rapid overview of curing times.
In the manufacture of parts for housings from filled molding compounds it is important to know the relationship between the curing time and the reaction temperature. This has an important influence on the design of the process and the cycle time, whether this is for introducing modified molding compounds, for optimizing throughput or for redesigning the molding process.

 

 

 

 Handbook   
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Keywords
Thermosets 2
  144
 thermoset, curing, DSC, conversion curve, curing kinetics, electrotechnical application, filler, MFK, molding resin, predictions, UF,


UF: Curing kinetics of molding compounds | Thermal Analysis Application No. HB85 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2