Time to Delamination of Printed Circuit Board by TMA According to ICP-TM-650 - METTLER TOLEDO

Time to Delamination of Printed Circuit Board by TMA According to ICP-TM-650

The ICP-TM-650 No. 2.4.24.1 test method describes a TMA method for the determination of the time up until which delamination of laminates and printed circuit board occurs. The experiment shows how such a determination is performed, e.g. for quality control purposes.

 

 

 

 

 

 Handbook   
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Keywords
 Thermosets 2
  98
 thermoset, curing, TMA, PCB, time to delamination, delamination time,
 


Time to Delamination of Printed Circuit Board by TMA According to ICP-TM-650 | Thermal Analysis Application No. HB 65 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2