Delamination of Printed Circuit Boards by TMA-EGA - METTLER TOLEDO

Delamination of Printed Circuit Boards by TMA-EGA

To determine the temperature of the first irreversible change (delamination) using TMA as a very sensitive method and at the same time identify the nature of the gases evolved.
If printed circuit boards are exposed to excessive heat, e.g. in a soldering bath, there is the risk that the layers of the board separate (delaminate). This is hardly visible but it can destroy the electrical connections. If the thermal stress is too high, decomposition can continue, in which case gases are evolved that cause further damage.

 

 

 

 Handbook   
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Keywords
 Thermosets 2
  96
 thermoset, curing, TMA, delamination temperature, EGA, flame retardant, PCB, bromine, expansion behavior, methyl bromide, MS, softening,


Delamination of Printed Circuit Boards by TMA-EGA | Thermal Analysis Application No. HB 64 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2