Aging of Printed Circuit Boards

The glass transition temperature is measured by DSC and used as quality criterion to check printed circuit boards for possible changes after aging tests.
Printed circuit boards are subjected to large changes in temperature in use. The conditions must not adversely affect the mechanical stability or other properties. This can be checked by performing any number of extreme temperature cycles and investigating the changes by thermal analysis.

_{Aging of Printed Circuit Boards | Thermal Analysis Application No. HB 62 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2}