Delamination of Printed Circuit Boards by TMA-MS - METTLER TOLEDO

Delamination of Printed Circuit Boards by TMA-MS

Introduction

A TMA instrument is used to study the dimensional changes of a material as a function of temperature or time.

Depending on the measurement mode used, TMA allows you to measure:

  • thermal expansion and shrinkage behavior,
  • softening, and
  • changes in mechanical properties of materials induced by physical or chemical transitions such as the glass transition, crystallization, melting and curing.

As with TGA, a TMA instrument can be coupled to a gas analyzer for the analysis of evolved gases.

In this experiment, TMA-MS was used to identify the degradation products formed during the delamination process of a printed circuit board.

Sample: Printed circuit board (PCB) made from fiberglass with a special epoxy matrix resin

Measuring cell: TMA-MS

Delamination of Printed Circuit Boards (PCB)
Delamination of Printed Circuit Boards (PCB)

Delamination of Printed Circuit Boards by TMA-MS | Thermal Analysis Handbook No.HB614 | Application published in METTLER TOLEDO TA Application Handbook Evolved Gas Analysis