To measure the glass transition temperature and the coefficient of thermal expansion, CTE, in the z-axis according to the ICP-TM-650 No. 2.24.4 test method.
These tests are suitable for dielectric materials used in printed boards.
The application describes how these tests are performed.
Handbook | | Page | | Keywords |
Thermosets 2 | 73 | thermoset, curing, TMA, CTE, glass transition by TMA, PCB, thermal expansion, |
Glass Transition Temperature and Z-axis Thermal Expansion by TMA According ICP-TM-650 | Thermal Analysis Application No. HB 54 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2