The Effect of Stoichiometry on Curing and the Resulting Glass Transition Temperature

To investigate the effect of the stoichiometry on the glass transition temperature, Tg, of an epoxy–amine system with excess of the amine or the epoxy.
The stoichiometric ratio of amine to epoxy may be defined as r = |A|/|E|, where |A| and |E| are the number of gram-equivalents of amine and epoxy monomer. The compositions analyzed in this experiment are the stoichiometric one with r = 1 and non-stoichiometric ones with r < 1, which implies an excess of epoxy, and r > 1, which indicates an excess of amine.

 

 

 

 Handbook   
 Page   
Keywords
 Thermosets 2 
  37 
 thermoset, curing, DSC, DGEBA, hot press, mixing ratio, polycondensation, prepreg, SDTA®, stoichiometry, triamine hardener, curing reaction, evaporation, mass loss,

 

The effect of stoichiometry on curing and the resulting glass transition temperature | Thermal Analysis Application No. HB 40 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2