Total Analysis with DSC, TGA, TMA and TGA-EGA

This work uses the investigation of printed circuit boards as an example to show how the results from different thermoanalytical techniques can be evaluated to make a comprehensive assessment of the product. Such comprehensive investigations are often necessary for R&D, damage assessment and the analysis of competitive samples and products. Modern evaluation software allows the complex facts of such an investigation to be presented clearly.

^{Total analysis with DSC, TMA and TGA-EGA | Thermal Analysis Application No. UC 93 | Application published in METTLER TOLEDO Thermal Analysis UserCom 9}