Determination of Curing Behavior

The curing of a thermoset is normally studied using DSC by measuring the heat of the reaction and the resulting glass transition temperature. However, DSC can not determine the increase of the viscosity or the modulus of elasticity during curing. TMA is then the method of choice, especially if bending measurements are performed. In this article, an epoxy adhesive is used as an example to demonstrate how TMA can be used to measure these properties simultaneously.

^{Determination of curing behavior using TMA /SDTA | Thermal Analysis Application No. UC 76 | Application published in METTLER TOLEDO Thermal Analysis UserCom 7}