UF Molding Compounds: Influence of Processing (Molding)

The purpose of this application is to demonstrate the influence of the molding process on material properties using DSC, for example to compare a molded bar with the corresponding unmolded powder.

 

 

 

 

 

 

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Keywords
Thermosets 2
  142
 thermoset, curing, DSC, electrotechnical application, molding reaction, processing of thermosets, UF,


UF molding compounds: Influence of processing (molding) | Thermal Analysis Application No. HB84 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2

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