The purpose of this application is to demonstrate the influence of the molding process on material properties using DSC, for example to compare a molded bar with the corresponding unmolded powder.
Handbook | | Page | | Keywords |
Thermosets 2 | 142 | thermoset, curing, DSC, electrotechnical application, molding reaction, processing of thermosets, UF, |
UF molding compounds: Influence of processing (molding) | Thermal Analysis Application No. HB84 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2