PF: Paper Prepregs for Plywood

To show how DSC measurements and kinetic evaluations can be used to predict reaction times at particular press temperatures.
Phenolic resins are the adhesives most frequently used for the manufacture of plywood. When the layers are compressed under the action of heat, it is important to know the reaction times and temperatures. In this application, three different phenolic resins coated on paper are compared.

 

 

 

 

 Handbook   
 Page   
Keywords
Thermosets 2
  135
 thermoset, curing, DSC, adhesive, coatings, evaporation, plywood, polycondensation, predictions, prepreg, pressure crucible, activation energy, conversion curve, MFK,


PF: Paper Prepregs for Plywood | Thermal Analysis Application No. HB81 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2

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