Quality Assurance, Failure Analysis of Adhesive Bonds

The purpose of the experiment was to investigate whether the adhesive bonds between metal parts had been sufficiently cured. This can be easily done using DSC measurements. For comparison, a good and a bad bond were measured.
DSC has the advantage that only small amounts of material are used for measurements. Faulty adhesive bonds can therefore be analyzed afterward by taking a small sample of the adhesive from the bond.
A two-component epoxy resin was used to bond two metal parts. When the parts were used, it became clear that some of the bonds failed at slightly elevated room temperatures.

_{Quality Assurance, Failure Analysis of Adhesive Bonds | Thermal Analysis Application No. HB 66 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2}