To measure the glass transition temperature, Tg, and the cure factor according to standard method ICP-TM-650 No. 2.4.25.
These tests are suitable for prepreg, metallic clad or unclad laminates, and printed circuit boards. It also provides a determination of relative degree of cure, or Cure Factor (CF) for some types of materials. The application shows how these determinations are performed.
Handbook | | Page | | Keywords |
Thermosets 2 | 71 | thermoset, curing, DSC, fibers, glass transition, PCB, cure factor, |
Glass transition temperature and "Cure Factor" by DSC according to ICP-TM-65 | Thermal Analysis Application No. HB 53 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2