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Ceramic Sensor HSS 8+ (DSC 1/3)

Innovatie in DSC-meettechnologie

Om zwakke effecten te meten.

Buitengewoon robuust voor kwaliteits controle.

Dit is vaak van groot belang bij actieve farmaceutische stoffen, voedingsmiddelen, polymeren of biotechnologische en medische producten.

120 thermokoppels in serie

Of bij kleine hoeveelheden zoals vaak het geval is in farmaceutische, medische of forensische onderzoeken.

Artikelnummer: 51143280

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Specificaties - Ceramic Sensor HSS 8+ (DSC 1/3)
Techniek
Differentiële scanning calorimetrie (DSC)
Type
Sensor
Accessoire
Nee
Signaaltijd
3,9 s
Optie
Ja
Temperatuurbereik
-150 °C – 700 °C
Thermokoppels
120

Documentatie

Gebruikerscomm

Thermal Analysis UserCom 31
Thermal analysis applications, including useful tips for how thermal analysis can be used to analyze polymers (Part 1: DSC of thermoplastics).
Thermal Analysis UserCom 30
Thermal analysis applications, including useful tips on the correct use of analytical measurement terminology (Part 2: Measurement uncertainty).
Thermal Analysis UserCom 29
Thermal analysis applications, including useful tips on the correct use of analytical measurement terminology (Part 1: Trueness, precision and accurac...
Thermal Analysis UserCom 28
Thermal analysis applications, including useful tips for cp determination at high temperatures by TGA/DSC (Part 2: Applications).
Thermal Analysis UserCom 27
Thermal analysis applications, including useful tips for cp determination at high temperatures by TGA/DSC (Part 1: DSC standard procedures).
Thermal Analysis UserCom 26
Thermal analysis applications, including useful tips on method choice and evaluation possibilities for DMA measurements.
Thermal Analysis UserCom 25
Thermal analysis applications, including useful tips for choosing the right baseline. The detection and evaluation of weak sample effects in DSC, is a...
Thermal Analysis UserCom 24
Thermal analysis applications, including a TA tip article on the influence of absorbed moisture on the mechanical properties of Polyamide 6.
Thermal Analysis UserCom 23
Thermal analysis applications, including useful tips for determining optimum parameters for DMA experiments.
Thermal Analysis UserCom 22
Thermal analysis applications, including useful tips for method development (Part 2).

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Ceramic Sensor HSS 8+ (DSC 1/3)