Need assistance?
Our team is here to achieve your goals! Speak with our experts.

UF Molding Compounds: Influence of Processing (Molding)

The purpose of this application is to demonstrate the influence of the molding process on material properties using DSC, for example to compare a molded bar with the corresponding unmolded powder.

 

 

 

 

 

 

 Handbook   
 Page   
Keywords
Thermosets 2
  142
 thermoset, curing, DSC, electrotechnical application, molding reaction, processing of thermosets, UF,


UF molding compounds: Influence of processing (molding) | Thermal Analysis Application No. HB84 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2

UserCom and Application Notes