The ICP-TM-650 No. 2.4.24.1 test method describes a TMA method for the determination of the time up until which delamination of laminates and printed circuit board occurs. The experiment shows how such a determination is performed, e.g. for quality control purposes.
Handbook | | Page | | Keywords |
Thermosets 2 | 98 | thermoset, curing, TMA, PCB, time to delamination, delamination time, |
Time to Delamination of Printed Circuit Board by TMA According to ICP-TM-650 | Thermal Analysis Application No. HB 65 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2