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PF: Curing Kinetics of Resol Resins

The purpose of the application is to show how DSC measurements can be used to predict the reaction behavior of a resin [1].
Knowledge of the influence of temperature on the reaction rate of phenol-formaldehyde resins (PF resols for adhesives and glues) allows the polycondensation rate to be predicted. This is of great practical importance for example in the manufacture of wood composite materials or the storage of resins. DSC measurements can rapidly characterize the performance of newly produced adhesives. The most important quantities are the reaction rate and the degree of conversion, which strongly influence the mechanical properties and the resistance toward moisture.

 

 Handbook   
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Keywords
Thermosets 2
  140
 thermoset, curing, DSC, adhesive, curing kinetics, predictions, reaction rate, resol, activation energy, MFK,