Quality Assurance in the Production of Printed Circuit Boards

To demonstrate the repeatability of the determination of the glass transition temperature. This is very important for quality control.
The degree of cure of printed circuit boards is routinely determined in quality assurance and is mainly responsible for the mechanical properties of the board. A board that is not properly cured undergoes further crosslinking with accompanying shrinkage in the soldering process that follows. This can lead to conduction tracks lifting off.
The degree of cure is determined from the glass transition temperature using two heating runs. Since the materials are highly filled, the DSC instrument must be very sensitive so that the glass transitions can also be evaluated automatically.

_{Quality Assurance in the Production of Printed Circuit Boards | Thermal Analysis Application No. HB 59 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2}