The curing reaction transforms a thermosetting resin from a low viscosity liquid to a rigid solid. The modulus changes dramatically during this reaction. The application shows how these changes can be investigated and how the glass transitions of the unreacted and cured adhesive can be determined in one measurement run.
Handbook | | Page | | Keywords |
Thermosets 2 | 28 | thermoset, curing, DMA, shear mode, curing measured by DMA, DDM, degree of cure, DGEBA, shear clamp for liquids, softening, dropping point, FP, prepreg, softening point, softening temperature, TOPEM®, viscosity, modulated DSC, temperature modulated DSC, oscillating DSC |
Curing of an EP resing measured by DMA | Thermal Analysis Application No. HB 36 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 2