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用户通讯

Thermal Analysis UserCom 58

用户通讯

UserCom—the Biannual Application Journal for All Thermal Analysis Users

Thermal Analysis UserCom 58
Thermal Analysis UserCom 58

Table of Contents:

TA Tip

  • The influence of water in solid materials, Part 2: Interactions measured by TGA-Sorption

News

  • Imaging packages for hot-stage microscopy and DSC microscopy
  • New Application Booklet – Thermal Analysis for Environmental Industries
  • Calibration software tips

Applications

  • Tips on adjusting a DSC instrument with indium in gold-plated high-pressure crucibles
  • Application of the Flash DSC for the development of materials for solar cells
  • Lithium-ion batteries, Part 1: Application examples of separators
  • Thermal analysis of aspartame
  • Retrogradation of maize starches

Dates

  • Exhibitions, Conferences, and Seminars